WEEE 2002/96/WE and ROHS 2002/95/WE directives introduce need of using non-lead soldering processes.
Lead free soldering alloys (i.e. Sn/Ag/Cu) with their melting points reaching up to 280°C require higher temperatures then traditional tin-lead (Sn/Pb) ones. That require more strict control of thermal processes in time of soldering and usage of high thermal resistant labeling materials. Those directives require that every material used in production to pass verification. If in production process that require now higher temperatures You were using polyester (it will be useless now) You must replace it with other materials - i.e. polyimid.
In connection with above events Pakom company from Gdynia, authorized dealer of american Polyonics Inc., offers You polyimid labels that have excellent resistance to high temperatures, harsh fluxes, cleaning agents, saponifiers and wave solder environments, and resist all commonly used methods of cleaning. Polyimid (PI) is thermo plastic material that thanks to its resistances can be used to manufacture labels with barcodes that can resist wave soldering enviroment of circuit boards (PCB) manufacture processes without any damage. Higher temperatures might require usage of even more resistant labels - i.e. ones from XF582 material or other Polyonics Inc. materials. All of those are offered by Pakom company.
